The new E revisions of IPC's popular desk reference IPC-DRM-PTH, Through-Hole Solder joint Evaluation Training & Reference Guide and IPC-DRM-SMT Surface Mount Solder Joint Evaluation Training & Reference Guide have been released. Updated in line with the recent revisions of the industry's most widely recognized standards, IPC-A-610 and IPC-J-STD-001, these compact, spiral-bound booklets are handy reference tools illustrating critical acceptance criteria for the evaluation of through-hole and surface mount solder connections.
Useful as training aids in the classroom or on the shop floor, the booklets help inspectors and operators make the right solder joint acceptance decisions for all three classes of product. Along with color illustrations and sharp photographs, cross references to appropriate specification/paragraph in both IPC-A-610E and J-STD-001E are included to help the user further verify the appropriate acceptance criteria. In addition, every change from the D to E revision has been notated to make it easy for users to learn the new requirements.
IPC-DRM-PTH-E contains computer-generated color illustrations of component, barrel and solder-side perspectives of a plated-through hole. Each drawing clearly shows the minimum acceptable condition for requirements such as land coverage, vertical fill, wetting of lead, land and barrel and contact angle.
IPC-DRM-PTH-E also provides high-quality color microphotographs of the major solder defects and conditions such as nonwetting, corrosion, projections, fractures, lead protrusion and disturbed joints with pictures of both tin-lead and lead-free solder joints.
IPC-DRM-SMT-E contains computer generated color illustrations of chip component, gull wing and j-lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
IPC-DRM-SMT-E also provides high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections.